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Broadcom names lenders for a $63 billion Anthropic chip-financing structure

Broadcom and its financing partners announced a $63 billion transaction to place its AI processors and networking equipment in a special-purpose vehicle that will lease them to Anthropic. Equipment delivery is planned for 2027.

Bank of America, Citi and Morgan Stanley supply first-lien financing; Blackstone is the sole committed second-lien lender. Broadcom provides residual-value support equal to the first-lien amount. That leaves the chip supplier exposed to equipment value, even as outside lenders supply capital. The release establishes a committed structure, not confirmed closing or delivered computing capacity. SourcesA

Sources

• ABroadcom names lenders for a $63 billion Anthropic chip-financing structureinvestors.broadcom.com

This story ran in the Morning Brief of October 27th 2026.