Aug 27 2026

SK Hynix breaks ground on a $4 billion HBM advanced-packaging plant in Indiana, mass production in H2 2029

CHIPSINFRA

Original reporting

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First US production base for the company that holds 58% of the HBM market, packaging Korea-made wafers into finished HBM on US soil. The 2029 start signals the memory shortage is not clearing this year.

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SK Hynix

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